Simulation based analysis of LED package reliability regarding encapsulant related failures
Stefan Watzke
Hrsg.: Fraunhofer IZM, Berlin
2016, 166 S., zahlr., teils farb. Abb. u. Tab., Softcover
Berlin, TU, Diss., 2015
Fraunhofer Verlag
ISBN 978-3-8396-0956-9

Inhalt
Within the work several LED encapsulation material related reliability issues are investigated by means of finite element analysis (FEM). The typically used silicone and epoxy materials are mechanically characterized after subjecting them to different environmental conditions. Based on these investigations material models for the FEM are created. Finally, the material models are used to simulate some encapsulation related reliability issues.

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