Buch: A Method for the Assembly of Microelectronic Packages using Microwave Curing
A Method for the Assembly of Microelectronic Packages using Microwave Curing
Stuttgarter Beiträge zur Produktionsforschung, Band 80
Raphael Adamietz
Hrsg.: Fraunhofer IPA, Stuttgart
2018, 244 S., num., mostly col. illus. and tab., Softcover
Sprache: Englisch
Stuttgart, Univ., Diss., 2017
Fraunhofer Verlag
ISBN 978-3-8396-1333-7

zur Open Access Version

Advanced electronic packaging continues to gain prevalence, driven by the continuous trend for miniaturization with concurrent functional integration. Processes in use today are efficient for mass production, but are not suitable for the purposes of low volume and prototype production. To overcome these problems, a novel method for the assembly of electronic packages is proposed, one that improves the efficiency of assembly processes and reduces the handling effort between the separate process steps by integration of assembly and curing process equipment into a single machine. An analysis of the field of electronic packaging with particular respect to adhesive curing processes is performed, the relevant state-of-the-art is reviewed and the need of a novel method is identified. The conception and realization of a microwave curing system, based on an open-ended waveguide resonator and a prototype machine integrating the curing system are carried out. This is followed by extensive evaluation and testing of the novel method. The proposed method provides reduction of curing cycle times for different adhesive materials and improvement of the overall process efficiency.

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