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Bücher, CDs, Broschüren (55):
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Multimodal Learning for Clinical Decision Support and Clinical Image-Based Procedures
10th International Workshop, ML-CDS 2020, and 9th International Workshop, CLIP 2020, Held in Conjunction with MICCAI 2020, Lima, Peru, October 4-8, 2020, Proceedings
2020, xii, 138 S., XII, 138 p. 4 illus. 235 mm, Softcover
Springer
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10th International Workshop, ML-CDS 2020, and 9th International Workshop, CLIP 2020, Held in Conjunction with MICCAI 2020, Lima, Peru, October 4-8, 2020, Proceedings
2020, xii, 138 S., XII, 138 p. 4 illus. 235 mm, Softcover
Springer
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Enterprise Interoperability VIII
Smart Services and Business Impact of Enterprise Interoperability
2019, xviii, 443 S., XVIII, 443 p. 148 illus., 103 illus. in color. 235 mm, Hardcover
Springer
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Smart Services and Business Impact of Enterprise Interoperability
2019, xviii, 443 S., XVIII, 443 p. 148 illus., 103 illus. in color. 235 mm, Hardcover
Springer
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Springer Handbook of Science and Technology Indicators
2019, xxxviii, 1103 S., XXXVIII, 1103 p. 279 illus. in color. 260 mm, Hardcover
Springer
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2019, xxxviii, 1103 S., XXXVIII, 1103 p. 279 illus. in color. 260 mm, Hardcover
Springer
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Uncertainty for Safe Utilization of Machine Learning in Medical Imaging and Clinical Image-Based Procedures
First International Workshop, UNSURE 2019, and 8th International Workshop, CLIP 2019, Held in Conjunction with MICCAI 2019, Shenzhen, China, October 17, 2019, Proceedings
2019, xvii, 192 S., XVII, 192 p. 83 illus., 76 illus. in color. 235 mm, Softcover
Springer
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First International Workshop, UNSURE 2019, and 8th International Workshop, CLIP 2019, Held in Conjunction with MICCAI 2019, Shenzhen, China, October 17, 2019, Proceedings
2019, xvii, 192 S., XVII, 192 p. 83 illus., 76 illus. in color. 235 mm, Softcover
Springer
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Raphael Adamietz
A Method for the Assembly of Microelectronic Packages using Microwave Curing
Stuttgarter Beiträge zur Produktionsforschung, Band 80
Hrsg.: Fraunhofer IPA, Stuttgart
2018, 244 S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag
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A Method for the Assembly of Microelectronic Packages using Microwave Curing
Stuttgarter Beiträge zur Produktionsforschung, Band 80
Hrsg.: Fraunhofer IPA, Stuttgart
2018, 244 S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag
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David Bücheler
Locally Continuous-fiber Reinforced Sheet Molding Compound
Wissenschaftliche Schriftenreihe des Fraunhofer ICT, Band 79
Hrsg.: Fraunhofer ICT, Pfinztal
2018, 192 S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag
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Locally Continuous-fiber Reinforced Sheet Molding Compound
Wissenschaftliche Schriftenreihe des Fraunhofer ICT, Band 79
Hrsg.: Fraunhofer ICT, Pfinztal
2018, 192 S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag
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Video-to-Video Face Recognition for Low-Quality Surveillance Data
Dissertationsschrift
2018, 182 S., graph. Darst. 210 mm, Softcover
KIT Scientific Publishing
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Dissertationsschrift
2018, 182 S., graph. Darst. 210 mm, Softcover
KIT Scientific Publishing
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Chromatisch konfokale Triangulation - Hochgeschwindigkeits 3D-Sensorik auf Basis der Wellenlängenschätzung mit optimiert
Dissertationsschrift
2018, 172 S., graph. Darst. 210 mm, Softcover
KIT Scientific Publishing
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Dissertationsschrift
2018, 172 S., graph. Darst. 210 mm, Softcover
KIT Scientific Publishing
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Markus Mundus
Ultrashort Laser Pulses for Electrical Characterization of Solar Cells
Solare Energie- und Systemforschung / Solar Energy and Systems Research
Hrsg.: Fraunhofer ISE, Freiburg
2016, 272 S., Softcover
Fraunhofer Verlag
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Ultrashort Laser Pulses for Electrical Characterization of Solar Cells
Solare Energie- und Systemforschung / Solar Energy and Systems Research
Hrsg.: Fraunhofer ISE, Freiburg
2016, 272 S., Softcover
Fraunhofer Verlag
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Dirk Schwantuschke
Modeling of Dispersive Millimeter-Wave GaN HEMT Devices for High Power Amplifier Design
Science for Systems, Band 23
Hrsg.: Oliver Ambacher; Fraunhofer IAF, Freiburg
2016, ca. 200 S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag
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Modeling of Dispersive Millimeter-Wave GaN HEMT Devices for High Power Amplifier Design
Science for Systems, Band 23
Hrsg.: Oliver Ambacher; Fraunhofer IAF, Freiburg
2016, ca. 200 S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag
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