Leonie Jakob
Through-mask Electrochemical Machining for Conductor Track Manufacturing – Fundamental Insights and Practical Implications
Solare Energie- und Systemforschung / Solar Energy and Systems Research
Hrsg.: Fraunhofer ISE
2025, 295  S., num., mostly col., illus. and tab., Softcover
Fraunhofer Verlag

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Wieland Heyn
Micromechanical studies of interface properties in on-chip interconnect structures
Schriftenreihe Kompetenzen in Keramik und Materialdiagnostik / Publication series competencies in ceramics and materials diagnostics, Band 5
Hrsg.: Alexander Michaelis; Fraunhofer IKTS, Dresden
2024, 132  S., num., mostly col. illus. and tab, Softcover
Fraunhofer Verlag

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Multiscale Simulation of Metallic Copper and Copper Oxide Atomic Layer Deposition from Cu Beta-diketonates
2018, 207   S., Hardcover
readbox publishing

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Achim Kraft
Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells
Solare Energie- und Systemforschung / Solar Energy and Systems Research
Hrsg.: Fraunhofer ISE, Freiburg/Brsg.
2015, 290  S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag

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Christian Geisler
Characterization of Laser Doped Silicon and Overcoming Adhesion Challenges of Solar Cells with Nickel-Copper Plated Contacts
Solare Energie- und Systemforschung / Solar Energy and Systems Research
Hrsg.: Fraunhofer ISE, Freiburg/Brsg.
2015, 195  S., num., mostly col. illus. and tab., Softcover
Fraunhofer Verlag

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